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News Letter |
Tuesday 21 October,2014 |
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| Wire Bonding in EDWinXP
& EDWINNET!!! |
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The Wire Bond Explorer allows the packaging engineer to parametrically design the fan out pattern for a die.
This tool also has a 3D Viewer allowing the designer to see the design from all angles. Cross referencing between the netlist and die is also available. Outputs in clued DXF format as well as an enhanced LIQ format that is currently accepted by PADS and
EDWinXP & EDWinNET.
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
Read More
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This Package consists:-
*Wire Bond Explorer
*3D LIQ Viewer
*Fanout Generator
*Die Attach Pad Editor
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AsPacker is an integrated tool used by ASIC and packaging engineers. The Pad Ring Explorer allows ASIC engineers to design and
analyze the pad ring of design. The tool outputs scripts that directly interface
with Astro and AtopTech tools. Other interfaces can be developed on request.
You can download AsPacker from the following th efollowing link.
AsPacker Download
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