AsPacker is a tool that aids the designer integrate bare die or chips into their projects.
AsPacker automates the process eliminating errors that can be made during hand editing a
package layout. It is fully programmable and flexible with many options to explore while
trying to achieve the best design possible for your needs. High pin-out die can be a nightmare
to deal with unless you have a tool like AsPacker do the work for you. It is simple to learn and
easy to use.
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Any body wishing to take advantage of using bare die or chips in their designs will benefit by using AsPacker. It eliminates the guess work of hand editing by using design rules to drive the process. For the advanced users it can be used in the design on Multi Chip Modules, Hybrid circuits and Packages.
Benefits of using it.
By using AsPacker the time from start to finish is greatly reduced while increasing the design integrity and reliability. There are many design rules that have to be followed in order to produce a fan-out that is usable. These rules are supplied by the PCB house, Wire Bond house, and the Die manufacturer. AsPacker applies all these rules to produce the finished fan-out that is ready to be imported into EDWin.
How it works
AsPacker takes the Design rules supplies by the various vendors along with some setup parameters and with a push of a button produces the Wire Bond Fan-out. The Die definition can come either from an LIQ file that EDWin produces or the Die manufacturer in the form of a pinlist file. Both of these describe the die and pad locations. All commands are recorded and can be edited and played back at any time or used in future projects thus making the design process repeatable, reliable and reusable. Once you are happy with the design it can be imported into EDWin for the final processing of the package design.