Check list for EDWINXP Package creation
- Use EDWinXP Package naming conventions
- Use Correct Package Type
- Package description should be given as EDWinXP convention.
- Consider top view of component for land pattern or Package creation according to datasheet and EDWinXP standards
- Reference designator should be placed on first pin
- First pin indicator should be given according to EDWinXP convention
- Land pattern dimensioning should be as Datasheet and should meet EDWinXP standard
- Padstack dimensioning should be as EDWinXP standard and necessary soldermask area should be given
- Spacing between pin should be given as in datasheet
- Component outline should be placed as datasheet on silkscreen layer(comp.print)
- Component courtyard should be given beyond component outline
- Option for solder paste should be given
- Option for Keep off Zone should be given if needed
- Package name and package description should be on comp.print with font size 60mils and font width 80mils
- 3d representation should be given as physical representation of component in datasheet