BGA (Ball Grid Array) Packages are created in EDWinXP from Package Editor of EDWinXP.
Procedure
Evoke EDWinXP: Start | Programs | EDWinXP | EDWinXP Main .
Open Package Editor: Right click Library and choose Library Editor .
Package Creation Wizard: File | New Package Using Wizard .
Set the Package Name as BGA192/M19x19 and Package type as Grid Array (PGA,BGA,..) as shown in the screen shot below.



Here 192 denote number of pins in this package and 19x19 denotes the Pin Matrix of the package. Click Next tab to continue.
In the Window, fill the required parameters as in given below example

No. of pins : 192
Pin to pin Distance : 1.27mm
Horizontal pitch between pads : 1.27mm
Length of Package outline : 25mm
Width Package outline : 25mm
No.of Bottom Row Pins : 19
Package Description : BGA 192/e 50/M 19x19
Padstack is selected by double clicking on the field Default Padstack.
From the drop down menu select suitable smd padstack. Click on Edit or create new Padstack to Make necessary changes to the padstack’s shape and size and click Make button




Click on Accept selection button, then automatically the padstack selected will be assigned as the Default Padstack
The resulting Screenshot is as shown below

Double Click Package Type field to select a Package Type. The window for selecting the package type is displayed. From the drop down menu select SMD | BGA and Click Accept as shown in below screen shot.



Click Next to continue to the next Step to show the details of the created padstacks as shown below,



Click Next to proceed. In this step make necessary arrangements like Width, Length and Offset values in X, Y Directions and to get the package preview



Click Next to proceed. The final window shows the details of the created Package as shown below and click Finish to finish creation



Save the created package: From the File Menu choose Save Package As BGA192/M19x19