EDWinXPis an EDA (Electronics Design Automation)software package for automated design of electronic products. This integrated tool covers all stages of electronic design process -schematic capture, simulation, PCB layout design, generation of PCB manufacturing and testing documentation.
EDWinNET 1.0 Standard
EDWinNET 1.0 Standard versioncomes with all Standard features of EDWinXP. This is the conversion and movement of EDWinXP to a new platform, .NET. Circuit designs can be front and back annotated i.e. a design may be started either from Schematic Editor or PCB Layout and design information is automatically updated.
AsPacker
AsPacker is a tool to explore and develop bare Die wirebond solutions for PCBs, MCMs, Hybrids and Packages. AsPacker is a tool that aids the designer integrate bare die or chips into their projects. It is fully programmable and flexible with many options to explore while trying to achieve the best design possible for your needs.
Visionics Sweden HB, Ga Norrtaljev 97,Sweden
Visionics India Pvt. Ltd.Technopark, Trivandrum ,Kerala.INDIA.
+91 471 2700673
www.visionics.a.se.
Mail Us:- viplasia@visionicsasia.net
