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17th March 2015

EDWinXP 1.95 Version Released !!!

We are extremely happy to announce the release of new version -EDWinXP 1.95. The new version has some additional features which helps you in complex designs. EDWinXP 1.95 which has evolved from the suggestions of EDWinXP Users. Of course, not all suggestions have been implemented yet. From the remaining suggestions, those we see as feasible for implementation shall be addressed in future releases.
 

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EDWinXP 1.95 New Features

Bury Via with respect to Start and End Layer(PCB Layout Editor)

Property of Vias(PCB Layout Editor)

Possibility to have all traces within a net highlighted when routing.(PCB Layout Editor)

Title block(Schematic Editor).

Listing Unconnected pins(Schematic Editor).

Library Explorer now supports exporting list of library items to any spreadsheet application.

Component Clockwise Rotation(Schematic Editor).

Restore Default Settings(General).

AsPacker

AsPacker is a tool to explore and develop bare Die wirebond solutions for PCBs, MCMs, Hybrids and Packages. AsPacker is a tool that aids the designer integrate bare die or chips into their projects. It is fully programmable and flexible with many options to explore while trying to achieve the best design possible for your needs.                                           Read more...


Note: AsPacker will be uploaded within 2 weeks

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Visionics Sweden HB, Ga Norrtaljev 97,Sweden
Visionics India Pvt. Ltd.Technopark, Trivandrum ,Kerala.INDIA.
+91 471 2700673 www.visionics.a.se.
Mail Us:- viplasia@visionicsasia.net