EDWinXP 1.70 at a glance

[EDWin Support]

We are extremely happy to announce the release of our new version - EDWinXP 1.70. On this occasion, we thank all of you for your valuable suggestions and feedback which helped us to deliver the best possible solution in PC-based EDA.

What's new in EDWinXP Version 1.70

As in previous year, our efforts concentrated on implementing specific features that were requested by our users. This is an ongoing process and the version 1.70 includes all those new elements that we have done so far. If some of suggested improvements could not be found in the list below, does not mean that the idea was discarded. Most of them are in the pipeline and will be gradually added to the package.

Library editor

* New dialog for Padstack design
* Polygons in Packages, Symbols and Padstacks
* 3D Elements
* Library Package Creation Wizard has been enhanced with two new types – SOIC and QFP

Schematics and PCB Layout Editors

* Dual Copy and Paste function
* Switch to reroute" and "Rip up before reroute" options in Schematics Editor

PCB Layout Editor

* Tapered trace segments
* Improved automatic renumbering function
* Global check and test report
* Characteristic Impedance Calculator

Fabrication Manager

* Changes in G-code export
* Separate toolbar for Copper Relief editing
* Gerber viewer replaced

Simulation

Together with release of EDWinXP 1.70 we release development kit with Motorola M68HC11A8 Microcontroller containing as usual the model, debugger, assembler and disassembler, C-compiler and several circuit examples

General features

* Automatic detection of updates
* Save Settings/Restore Settings
* Remembering latest file path
* New text input dialog with preview
* New color scheme for Property dialogs
* Magnifier
* Coordinate Zoom
* Ruler cursor